文章摘要
电子封装用有机硅/环氧树脂杂化材料的制备
Preparation of Silicone/Epoxy Hybrids for Electronic Packaging
  
DOI:10.16865/j.cnki.1000-7555.2018.03.019
中文关键词: 环氧基  硅树脂  透明度  有机无机杂化材料  电子封装
英文关键词: epoxy  silicone resins  transparent  organic-inorganic hybrid materials  electronic packaging
基金项目:
作者单位
郑梓聪,马文石 华南理工大学 材料科学与工程学院,广东 广州 510640 
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中文摘要:
      以γ-缩水甘油醚氧丙基三甲氧基硅烷和苯基、甲基烷氧基硅烷为原料,经水解缩合制得透明的环氧基苯基硅树脂预聚物(EPSR),将EPSR与环氧树脂E51按不同质量比共混,以甲基六氢苯酐为固化剂,乙酰丙酮铝为促进剂,经热固化得到透明的有机无机杂化材料,探究了EPSR/E51质量比对产物的固化行为及光学、热学、阻燃、防水、粘接等性能的影响。结果表明,随着EPSR含量的增加,固化温度下降,玻璃化转变温度下降,透明度上升,阻燃性增强,耐热性和吸水率先下降后上升,粘接强度下降。当EPSR/E51质量比为60/40~80/20时,固化产物的综合性能较好,有望用作电子封装材料。
英文摘要:
      Transparent silicone resins containing epoxy and phenyl groups (EPSR) were synthesized by hydrolysis and condensation of 3-glycidoxypropyl trimethoxysilane, phenyl and methyl alkoxysilane. EPSR and E51 were blended according to various mass ratio, and cured with methylhexahydrophthalic anhydride accelerated by aluminum 2,4-pentanedionate to obtain transparent organic-inorganic hybrid materials. The influence of EPSR/E51 mass ratio on curing behavior, optical and thermal properties, fire and water resistance, and adhesive property of the cured resins were studied. The results show that with the increase of EPSR content, curing temperature and glass transition temperature decline, transparency and flame retardant property improve, heat resistance and water absorption first decrease then increase, and adhesive strength is weakened. When the EPSR/E51 mass ratio is 60/40~80/20, the cured products have better comprehensive properties, expecting to be desirable electronic packaging materials.
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