文章摘要
具有极低熔体黏度的苯乙炔封端热固性聚酰亚胺树脂
Phenylethynyl Terminated Thermoset Oligoimides with Ultra-Low Melt Viscosity
  
DOI:doi: 10.16865/j.cnki.1000-7555.2020.0001
中文关键词: 苯乙炔  酰亚胺预聚物  熔体黏度  树脂传递模塑
英文关键词: phenylethynyl  oligoimides  melt viscosity  resin transfer molding
基金项目:宁波市自然科学基金资助项目(2018A610115,2019A610136);国家自然科学基金资助项目(51703231);浙江大学宁波理工学院校内项目(20190121Z0018)
作者单位
王 玮 浙江大学 宁波理工学院 高分子材料与工程研究所浙江 宁波 315100 
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中文摘要:
      为了开发适于树脂传递模塑(RTM)成型的低熔体黏度热固性聚酰亚胺树脂,采用2,2′,3,3′-三苯二醚四甲酸二酐(3,3′-HQDPA)和3,3′,4,4′-三苯二醚四甲酸二酐(4,4′-HQDPA)的混合物与3种不同的二胺单体合成了3种系列的苯乙炔封端的热固性聚酰亚胺树脂,其中二胺为4,4′-二氨基二苯醚(ODA),4,4’-二氨基-2,2’-双三氟甲基联苯(TFDB)和2-苯基-4,4′-二氨基二苯醚(p-ODA)。文中系统地研究了酰亚胺预聚物的结构和相对分子质量对预聚物的聚集态结构、熔体黏度及对固化后薄膜的热性能、力学性能的影响。研究结果表明,与ODA和TFDB不同,p-ODA的特殊化学结构使得由它合成的酰亚胺预聚物(相对分子质量为750)表现为无定形态,并在低温区具有极低的熔体黏度。它在200 ℃至280 ℃区间内任意温度恒温2 h后,熔体黏度都低于1 Pa·s,更适宜RTM成型。
英文摘要:
      To develop novel resin transfer molding (RTM) type oligoimides with lower melt viscosity, three series of phenylethynyl terminated thermoset oligoimides derived from the mixture of 1,4-bis(3,4-dicarboxyl phenoxy)benzene dianhydride (4,4′-HQDPA) and 1,4-bis(2,3-dicarboxyl phenoxy)benzene dianhydride (3,3′-HQDPA) with three different aromatic diamines were prepared, the diamines including 4,4’-oxydianiline (4,4′-ODA), 2,2′-bis(trifluoromethyl)benzidine (TFDB) and 2-phenyl-4,4’-diaminodiphenyl ether (p-ODA). Effects of the chemical structures and molecular weights of the oligoimides on their aggregated structures, melt processability as well as the thermal and mechanical properties of the cured films were then systematically investigated. XRD results indicate that ODA series oligoimides and TFDB series oligoimides show crystallinity in various degree. However, the asymmetric p-ODA enables the p-ODA series oligoimides to exhibit amorphous form. It is found that the amorphous oligoimide (o-p-1) with the molecular weight of 750 shows more lower melt viscosity at a low temperature and the melt viscosity can maintain below 1 Pa·s after o-p-1 is isothermally aged for 2 h at any temperature in the range of 200 ℃ to 280 ℃ by rheological measurements. The corresponding cured film also shows very good thermal stability by TGA. It might be more suitable for RTM processes in the future.
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