文章摘要
笼型聚倍半硅氧烷增韧3层聚酰亚胺薄膜的制备与性能
Preparation and Properties of Three-Layer Polyimide Films Toughened by Polyhedral Oligomeric Silsesquioxane
  
DOI:10.16865/j.cnki.1000-7555.2020.0011
中文关键词: 3层聚酰亚胺  增韧  柔性覆铜板
英文关键词: three-layer polyimide  toughen  flexible copper clad laminate
基金项目:2014年前沿与关键技术创新项目(2014B090916001)
作者单位
周宇彬,刘述梅,陈植耿,赵建青 华南理工大学 材料科学与工程学院广东 广州 510641 
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中文摘要:
      以3,3′,4,4′-联苯四酸二酐(BPDA)-对苯二胺(PDA)/4,4′-二苯醚二胺(ODA)型聚酰亚胺为芯层,将2,2′-双(4-(4-氨基苯氧基)苯基)丙烷(BAPP)-BPDA型聚酰胺酸涂覆于芯层的上、下表面并热亚胺化得到3层聚酰亚胺薄膜。为提高3层聚酰亚胺薄膜的韧性,将降冰片烯二酸酐-马来酰亚胺基七异丁基聚倍半硅氧烷交替共聚物(poly(MIPOSS-alt-NA))作为BPDA的共单体引入到上、下表层的热塑性聚酰亚胺中。结果表明,当poly(MIPOSS-alt-NA)的质量分数为6.0%时,3层聚酰亚胺薄膜的断裂伸长率从7.2%提高到14.5%,热膨胀系数则从27.0×10-6K-1降低至23.6×10-6K-1,与铜箔制备的柔性覆铜板剥离强度达到12.0 N/cm,针对拉伸断面电镜照片的变化对增韧机理进行了分析。
英文摘要:
      A series of three-layer polyimide films with sandwich-like structure were prepared by coating polyamic acid onto both sides of middle-layer polyimide and further thermal imidization. The middle-layer polyimide came from the condensation of 3,3′,4,4′-biphenyltetracarboxylic dianhydride(BPDA) and p-phenylenediamine(PDA) /4,4′-oxydianiline(ODA), and the top and bottom layers were the thermoplastic polyimide made from the polymerization of BPDA and 2,2′-bis[4-(4-aminophenoxy)phenyl] propan(BAPP). In order to improve the toughness of three-layer polyimide films, poly(MIPOSS-alt-NA) was introduced into the top and bottom layers. It is found that the elongation at break of the three-layer polyimide film increases from 7.2% to 14.5% and the coefficient of thermal expansion (CTE) decreases from 27.0×10-6K-1 to 23.6×10-6K-1 with 6.0% poly(MIPOSS-alt-NA). Furthermore, the peel strength of flexible copper clad laminate (FCCL) made with the three-layer polyimide film achieves 12.0 N/cm. The toughening mechanism was investigated by SEM micrographs of tensile-fractured surface.
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