Dialdehyde starch was obtained by raw material corn starch oxidized with sodium periodate under acid condition. The resorcinol-dialdehyde starch-formaldehyde (RDSF) resin adhesive was prepared by resorcinol (R) copolycondensation with aldehyde donor of dialdehyde starch and formaldehyde. The effects of dialdehyde starch content, copolycondensation pH, copolycondensation temperature and copolycondensation time on solid content, viscosity, curing time and bonding strength of RDSF resin adhesive were studied. The results show that RDSF resin adhesive has the best comprehensive performance when the dialdehyde starch content is 0.15 mol, copolycondensation pH is 9, copolycondensation temperature is 60 ℃ and copolycondensation time is 90 min. At this time, the solid content is 42.59%, the viscosity is 725 mPa·s, the curing time is 53 s, the dry bonding strength is 1.38 MPa, and the wet bonding strength is 1.17 MPa. The FT-IR results show that the structure of RDSF resin is similar to that of resorcinol formaldehyde (RF) resin, which indicating that RDSF resin could be used instead of RF resin. DSC analysis shows that the curing temperature and curing enthalpy of RDSF resin are lower than those of RF resin, the peak curing temperature is 77.43 ℃ and the enthalpy of curing is -238.91 J/g, indicating that the curing energy consumption of RDSF resin is lower.