A high temperature resistant bismaleimide/cyanate foam adhesive was synthesized by 4,4’-bismaleimide diphenylmethane (BMI-1), bisphenol A dicyanate (BADCy), phenolphthalein polyaryl ether sulfone (PES-C) and blowing agent. The cure reaction of resin was investigated by using differential scanning calorimetry (DSC), in situ FTIR. SEM analysis suggested foam evenly with fine cells: average cell diameter is 0.275mm. Thermogravimetric analyzer (TGA) suggested foam adhesive has higher temperature resistance: Td10 in air and nitrogen atmosphere is 393 oC and 412 oC, respectively. At 9.375 GHz, dielectric constant of foam is 1.65, Tan δ is 0.0057, showing excellent dielectric properties. Pipe shear test shows it has excellent bonding performance and temperature resistance: -55oC, 25oC and 150oC pipe shear strength are not less 7 MPa, 205 oC pipe shear strength is greater than 4 MPa. Tensile test of foam adhesive with a variety of materials shows that it has excellent bonding properties to a variety of materials: aluminum-aluminum tensile strength is 9.2MPa; titanium-titanium tensile strength is 5.9 MPa; bismaleimide composite material- bismaleimide composite material strength is 5.9 MPa.