The reaction kinetics of cationic polymerization of epoxy resins (ERl-4221) was investigated by differential scanning calorimetry (DSC). The analysis of non-isothermal data was carried out by using the model-fitting Kissinger. The apparent activation energy with the cation content of 1.0wt% was 81.76 kJ/mol. The results show that the cationic polymerization of epoxy resins was deferred reaction at room temperature and has obvious latent features. The curing parameters is obtained by adopting“T-β”extrapolation, and the die shear test and C-SAM test proves the validity of the curing parameters designed in this paper. These results constitute a theoretical basis for the curing and application of the die attach adhesive.