不同固化剂复配的耐高温环氧树脂体系性能
DOI:
作者:
作者单位:

东华大学化学化工与生物工程学院 生态纺织教育部重点实验室

作者简介:

通讯作者:

中图分类号:

基金项目:

国家自然科学基金资助项目(21671037,21771036)


Properties of High Temperature Resistant Epoxy Resin Cured by Different Mixed Curing Agents
Author:
Affiliation:

Fund Project:

  • 摘要
  • |
  • 图/表
  • |
  • 访问统计
  • |
  • 参考文献
  • |
  • 相似文献
  • |
  • 引证文献
  • |
  • 资源附件
  • |
  • 文章评论
    摘要:

    环氧树脂本身是一种热塑性树脂,只有加入固化剂,才能发生交联反应生成三维网状结构的热固性树脂,展现出优异的使用性能。因此,固化剂的选择和复配是决定环氧树脂使用性能的关键因素。4,4’-二氨基二苯砜(DDS)是一种应用较为广泛的高温固化剂,但其有着与环氧树脂混合后黏度较大、需要较高反应温度等缺点。本文选用了3,3’-二乙基-4,4’-二氨基二苯甲烷(DEDDM)、4,4’-二氨基二苯甲烷(DDM)、4-甲基1,3-环己二胺(HTDA)三种固化剂与DDS复配,通过非等温DSC法研究了复配固化剂的含量和种类对反应活化能的影响;通过DMA、TGA等测试研究了复配固化剂的的含量和种类对固化产物热性能的影响。结果表明,复配固化剂DDM含量为20%(mol比)时,黏度在操作温度80℃时降低了70.4%,平均反应活化能降低2.99kJ/mol,玻璃化转变温度仍保持219℃,符合耐高温树脂使用要求。综合考虑各方面性能,体系20DDM可用作环氧树脂复合材料体系的复配固化剂的首选。

    Abstract:

    Epoxy resin is a thermoplastic resin. It can show excellent performance only with adding curing agent to form three-dimensional network structure by cross-linking reaction. Therefore, the selection and combination of curing agent is the key factors to determine the performance of epoxy resin. 4,4'-diaminodiphenyl sulfone (DDS) is a widely used high-temperature curing agent, but it has some shortcomings, such as high viscosity mixed with epoxy resin and high reaction temperature. In this paper, 3,3'-diethyl-4,4'-diaminodiphenylmethane(DEDDM), 4,4'-diaminodiphenylmethane (DDM), 4-methyl-1, 3-cyclohexanediamine(HTDA) were used to combined with DDS. Non-isothermal DSC method was used to study the reaction activation energy of different contents and kinds of the mixed curing agent. The effects of the contents and kinds of the mixed curing agents on the thermal properties of the cured product were studied by DMA and TGA tests. The results showed that when the content of DDM was 20% (mol ratio), the viscosity decreased by 70.4% at 80℃, the average reaction activation energy decreased by 2.99kJ/mol, and the glass transition temperature remained 219℃, which met the requirements of high temperature resistant resin. Considering all aspects of properties, the system 20DDM can be used as the first choice of mixed curing agents for epoxy resin composites.

    参考文献
    相似文献
    引证文献
引用本文
分享
文章指标
  • 点击次数:
  • 下载次数:
  • HTML阅读次数:
  • 引用次数:
历史
  • 收稿日期:2021-11-08
  • 录用日期:2022-04-24
  • 网络出版日期:2022-04-14
  • 在线发布日期:
  • 出版日期:
您是第      位访问者
编辑出版 :《高分子材料科学与工程》编辑部
地址 :四川省成都市一环路南一段24号 四川大学高分子研究所
电话 :028-8540 1653  E-mail:gfzclbjb@163.net; gfzclbjb@vip.sina.com
高分子材料科学与工程 ® 2024 版权所有
技术支持:北京勤云科技发展有限公司