The main role of thermal interface materials (TIM) is to fill the pore defects between chip and radiator, establish heat conduction pathway, and improve heat dissipation performance of electronic devices. Most of the existing studies were focused on the exploration of high thermal conductivity and excellent mechanical properties of TIM, and the importance of TIM's reliable performance was often ignored. In this paper, the development status of TIM reliability performance in recent years was reviewed, and the effects of thermal filler matrix material and production process on TIM reliability were mainly analyzed, including the types of thermal filler and compounding methods, the types of silicone oil, viscosity, crosslinking density and reaction rate of raw materials pretreatment storage environment of raw materials and processing methods, and put forward solutions to effectively improve TIM's reliable performance. Finally, some feasible suggestions for TIM's future research direction were put forward.