In this paper, a series of photosensitive resin inks were produced by blending of 1-(piperidin-1-yl)-2-propen-1-one (PPEO), 1,9-nonanediol diacrylate (NDDA), tricyclo[5.2.1.02,6]deca-8-yl methacrylate (DPMA), tri-2- hydroxyethyl trimethacrylate of isocyanuric acid (THEITMA) and poly(ethylene glycol) diacrylate (PEDGA). The inks were cured by UV curing to result in a thin robust film. When the prepolymer PEGDA mass fraction is 5%, the cured sample exhibits the maximum glass transition temperature for 198 ℃ and a thermal decomposition temperature in nitrogen for 388 ℃. When the mass fraction of PEGDA reaches 10%, the tensile stress reveals the highest value of 53 MPa. When the mass friction of PEGDA is increased to 20%, the increase of number of C—H bonding structures results in a decrease in dielectric constant with the lowest value for 2.83 at 20 GHz. With PEGDA loading ranged 5% to 20%, the viscosity of the ink decreases from 41 mPa· s to 32 mPa· s, with a typical nature of Newtonian Fluid at the shear rate of 0~200 s^-1 simultaneously. These results indicate that the PEGDA series of photosensitive inks have excellent comprehensive performance and commendable application value in microelectronic and other high-tech communication fields.