In the electronic device industry, conductive adhesive is considered as new environmentally friendly connection method that can replace soldering. However, there is still a gap between the conductivity of conductive adhesive and the welding method. In order to improve the electrical conductivity of conductive adhesive, the influence laws of factors such as the proportion of curing agent in conductive adhesive, the filling amount of silver filler, and the proportion of coupling agent on the electrical conductivity were studied. A four-probe tester and a universal mechanical testing machine were used to test the volume resistivity and shear strength of the conductive adhesive. Moreover, the microscopic morphology and elemental composition of the silver filler were characterized by FT-IR, SEM, EDS, etc. The results show that when the ratio of epoxy resin / curing agent is 10∶6, the volume resistivity of the conductive adhesive is the lowest. Surface treatment of silver fillers with adipic acid/ethanol solvent can significantly reduce the content of organic component on the filler surface, thereby improving the conductivity of the conductive adhesive. With the increase of coupling agent dosage, the volume resistivity of the conductive adhesive shows a trend of first decreasing and then increasing, and the volume resistivity is the lowest when the coupling agent proportion is 1% . On this basis, the influence of conductive adhesive preparation process on conductivity was further explored. Orthogonal experiments were used to analyze important parameters in the preparation process of conductive adhesive. It is found that the stirring speed in the second stage of conductive adhesive dispersion has the most significant effect on conductivity. Through orthogonal experiment optimization, the volume resistivity of conductive adhesive is 4.9×10^-5 Ω·cm, which is reduced by about 20% . This work provides important reference for improving the conductivity of conductive adhesives.